Meier, KarstenKarstenMeierRöllig, MikeMikeRölligLiu, Y.Y.LiuBock, K.K.Bock2022-03-132022-03-132018https://publica.fraunhofer.de/handle/publica/40005910.1109/EPTC.2017.8277572The following topics are dealt with: integrated circuit interconnections; integrated circuit reliability; three-dimensional integrated circuits; copper; integrated circuit packaging; silicon; wafer level packaging; electronics packaging; and solders.enconference paper