Wünsche, S.S.WünscheClauß, C.C.ClaußSchwarz, P.P.SchwarzWinkler, F.F.Winkler2022-03-032022-03-031997https://publica.fraunhofer.de/handle/publica/19172610.1109/92.609870The paper presents a methodology for simulating the static and dynamic performance of integrated circuits in the presence of electro-thermal interactions on the integrated circuit die. The technique is based on the coupling of a finite element method (FEM) program with a circuit simulator. In difference to other known simulator couplings a time step algorithm is used. Its implementation into simulation tools is described. The thermal modeling of the die/package structure and the extended modeling of the electronic circuit is discussed. Simulation results which indicate the capabilities of the methodology for electro-thermal simulation are compared to experimental results.encircuit simulationfinite element simulationsimulator couplingthermalmodeling621004300journal article