Walter, H.H.WalterAuerswald, E.E.AuerswaldSchubert, A.A.SchubertDudek, R.R.DudekMichel, B.B.Michel2022-03-102022-03-102003https://publica.fraunhofer.de/handle/publica/344411en621Reliability Evaluations of Lead Free Soldered Packagesconference paper