Schweinböck, T.T.SchweinböckPressel, K.K.PresselAltmann, F.F.AltmannHoffrogge, P.P.HoffroggeGrimm, M.M.GrimmKeiper, B.B.Keiper2022-03-142022-03-142019https://publica.fraunhofer.de/handle/publica/410891SAM3 ("Smart Analysis Methods for 3D Integration in Advanced Microsystems and Corresponding Materials") was a French/German funded project dealing with research and development on new methods for failure analysis of advanced semiconductors and System-in-Package solutions. The project included French and German semiconductor and system suppliers, small and medium sized equipment suppliers, as well as R&D institutes. The project focused on three major topics: advanced fault isolation and defect localization, new sample preparation tools and their combinations, and advanced material characterization. In close collaboration between the different partners, new failure analysis related methods and new failure analysis flows have been investigated. In our contribution, we present selected results of new techniques including GHz Scanning Acoustic Microscopy, various laser techniques, as well as sample preparation using focused ion beam techniques and Raman-based stress characterization.enconference paper