Ndip, I.I.NdipBecker, K.F.K.F.BeckerBrandenburger, F.F.BrandenburgerLe, T.H.T.H.LeHuhn, M.M.HuhnBauer, J.J.BauerKoch, M.M.KochHempel, M.M.HempelSchneider-Ramelow, M.M.Schneider-RamelowLang, K.-D.K.-D.Lang2022-03-142022-03-142018https://publica.fraunhofer.de/handle/publica/40715210.1109/ESTC.2018.8546432We model, design, fabricate and measure bond wire antennas (BWAs) at mmWave frequencies, considering the impact of encapsulation and process variations which occur during fabrication. Our results reveal that BWAs can withstand the fabrication process, and retain their impedance and radiation characteristics, if properly designed. Therefore, we believe that bond wires can be used as antennas for the development of real-world wireless systems.en621conference paper