Mechanical and electrical packaging technologies by the application of functional layers at micro and nano scale

Haubold, M.M.HauboldBaum, MarioMarioBaumWiemer, MaikMaikWiemerGeßner, ThomasThomasGeßner2022-03-112022-03-112011https://publica.fraunhofer.de/handle/publica/374046enMechanical and electrical packaging technologies by the application of functional layers at micro and nano scaleconference paper