Jung, E.E.JungAschenbrenner, R.R.AschenbrennerBusse, E.E.BusseReichl, H.H.Reichl2022-03-092022-03-091997https://publica.fraunhofer.de/handle/publica/32828810.1109/EPTC.1997.723916Miniaturization is a key issue to achieve either high performance devices or to lower overall system costs. Here, flip chip technology provides excellent capabilities to fulfil the needs of both current and future requirements. In particular, the cost and performance sensitive markets of telecommunication and automotive applications are preparing to apply flip chip technology. The paper presents two product prototypes generated in a common European project, that were assembled with this target in mind. For the telecommunication sector, a low temperature cofired ceramic (LTCC) package with additional thin film wiring was chosen to provide the required interconnection density to accommodate 6 ICs on a ceramic BGA type package. For the automotive sector, a 4 IC MCM-L BGA module was assembled to provide the highest possible level of integration to allow a reduction of overall system costs.enautomotive electronicsball grid arraysceramic packagingflip-chip devicesintegrated circuit packaginglaminatemultichip moduletelecommunication equipment621conference paper