Laser direct imaging breaks new ground: Structuring of film thicknesses up to 20 µm for microelectronics

Under CopyrightRatajczak, LynnLynnRatajczakReinhardt, KathrinKathrinReinhardtKörner, StefanStefanKörner2024-12-042024-12-042024-09-16https://doi.org/10.24406/publica-3878https://publica.fraunhofer.de/handle/publica/47962110.24406/publica-3878enLaser direct imaging breaks new ground: Structuring of film thicknesses up to 20 µm for microelectronicspresentation