Boettcher, L.L.BoettcherKaraszkiewicz, S.S.KaraszkiewiczManessis, D.D.ManessisOstmann, A.A.Ostmann2022-03-042022-03-042014https://publica.fraunhofer.de/handle/publica/237339en621Power electronics packages with embedded components - recent trends and developmentsjournal article