Büchler, AndreasAndreasBüchlerKluska, SvenSvenKluskaBartsch, JonasJonasBartschGrübel, BenjaminBenjaminGrübelBrand, AndreasAndreasBrandGutscher, SimonSimonGutscherGlatthaar, MarkusMarkusGlatthaar2022-03-142022-03-142017https://publica.fraunhofer.de/handle/publica/40479410.1109/PVSC.2017.8366331Investigating modifications of the silicon/metal interface during the manufacturing process and the influence on properties of laser-structured Ni-Cu-plated contacts enabled optimizing the metallization process. The micro pattern induced by ultrashort pulsed lasers ensures adhesion even without nickel silicide formation. Minimizing growth of laser-induced and native oxide at the surface of the laser patterned contact openings before plating enables high fill-factors without HF-treatment before metal deposition. Skipping the wet-chemical treatment eliminates parasitic plating on precursors with defective ARC. Compared to the state-of-the-art plating sequence, the approach presented features less process steps and enables improved solar cell aesthetics.enSolarzellen - Entwicklung und CharakterisierungHocheffiziente Siliciumsolarzellen und neuartige ProzessePhotovoltaikSilicium-PhotovoltaikKontaktierung und StrukturierungPlatingHaftung621697conference paper