Ziesche, SteffenSteffenZiescheLenz, ChristianChristianLenzMüller-Köhn, AxelAxelMüller-KöhnScheithauer, UweUweScheithauerPartsch, UweUwePartsch2022-03-142022-03-142018https://publica.fraunhofer.de/handle/publica/40358710.1109/ESTC.2018.85463872-s2.0-85060022187The contribution deals with technologies to transform conventional planar ceramic interposers like thick film and multilayer ceramic substrates into functional 3D geometries comparable to polymer based Molded Interconnect Devices (MID). Different technological approaches like folding, cold and hot Embossing, Ceramic Injection Moulding and Additive Manufacturing are discussed.enthick-film technologyceramic multilayer technologyfoldingembossingceramic injection mouldingadditive manufacturinglithography based ceramic manufacturingaerosol jet printing620666conference paper