Boufercha, NourdinNourdinBouferchaSägebarth, JoachimJoachimSägebarthBurgard, MatthiasMatthiasBurgardOthman, NabihNabihOthmanSchäfer, WolfgangWolfgangSchäferSandmaier, HermannHermannSandmaier2022-03-102022-03-102007https://publica.fraunhofer.de/handle/publica/355609Latest roadmaps indicatre that the size of assembled silicon chips will dramatically be reduced. The size of these chips will be less than 500qm x 500 qm and will have a thickness lower than 50 to 70 qm. This reduction allows the use of flexible substrates and reduces the cost of the component as well. In parallel the costs of the manufacturing process should also be reduced.enMikrokomponentenMikromontageself-assemblymicro componentMikrotechnikMikrofluidikmicro fluidicconference paper