Mask and wafer topography effects in immersion lithography

Erdmann, A.A.ErdmannEvanschitzky, P.P.EvanschitzkyBisschop, P. deP. deBisschop2022-03-102022-03-102005https://publica.fraunhofer.de/handle/publica/34933410.1117/12.5994162-s2.0-25144525528en670620530Mask and wafer topography effects in immersion lithographyconference paper