Gemmler, A.A.GemmlerKeller, W.W.Keller2022-03-082022-03-081992https://publica.fraunhofer.de/handle/publica/319832Tremendous improvements in the performance of microelectronic devices have been creating increased demands on fabrication control and consequent application of a synergistic operational model, high quality gold layers have been deposited from a sulfitic gold electrolyte. Periodic recording both of existing process data and resulting layer properties yielded a synergistic model to control the plating using SEM and acoustomicroscopy. Futher factors that influence quality of gold deposits (hardness, roughness, uniformity) could be optimized by flexible process control.enGold PlatingGoldüberzugLeiterplattemicroelectronic deviceMikroelektronikPlatingSchutzschicht670conference paper