Mangold, T.T.MangoldGulde, P.P.GuldeNeumann, G.G.NeumannRusser, P.P.Russer2022-03-092022-03-091998https://publica.fraunhofer.de/handle/publica/33088610.1109/SMIC.1998.750217en621A multichip module integration technology on silicon substrate for high frequency applicationsconference paper