Koos, ChristianChristianKoosRandel, SebastianSebastianRandelFreude, WolfgangWolfgangFreudeZwick, ThomasThomasZwickScheytt, J.C.J.C.ScheyttWitzens, J.J.WitzensWalther, MartinMartinWaltherHarter, TobiasTobiasHarterUmmethala, SandeepSandeepUmmethalaKieninger, C.C.KieningerZwickel, H.H.ZwickelMarin-Palomo, P.P.Marin-PalomoMuehlbrandt, SaschaSaschaMuehlbrandtFüllner, C.C.FüllnerSchaefer, J.J.SchaeferGudyriev, S.S.GudyrievZazzi, A.A.ZazziMüller, J.J.MüllerTessmann, AxelAxelTessmann2022-03-142022-03-142020https://publica.fraunhofer.de/handle/publica/41134710.1109/BCICTS48439.2020.9392969Combining photonic integrated circuits (PIC) with millimeter-wave electronics opens novel perspectives in generation and detection of ultra-broadband signals with disruptive potential for a wide variety of applications. Here, we will give an overview on our recent progress in the field of ultra-broadband photonic electronic signal processing, covering device concepts such as silicon plasmonic integration, signal processing concepts such as Kramers-Kronig-based phase reconstruction of THz signals, as well as application demonstrations in the field of high-speed wireless data transmission.enphotonic integrationsilicon photonicplasmonicshybrid integrationTHz communicationKramers-Kronig receiver667conference paper