IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2014. Vol.1

2022-03-022022-03-022014978-1-4799-5268-7978-1-4799-5267-0https://publica.fraunhofer.de/handle/publica/157507IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2014. Vol.1