Bagdahn, J.J.BagdahnWiemer, M.M.WiemerPetzold, M.M.Petzold2022-03-102022-03-102005https://publica.fraunhofer.de/handle/publica/3481022-s2.0-31844438082Duringe use, directly wafer-bonded devices such as acceleration sensors, gyroscopes, micropumps, or microvalves are oxposed to continuously or periodically acting mechanical stresses particularly due to vibration, thermo-mechnical mismatch, or internal and external pressures. For theses kind of applications an proven strength and long-term reliability is required. It will be shown in that pater that fracture mechnical approaches can be applied for strength and lifetime analys es of wafer-bondet devices. These approaches consider the influence of bonding defects, micromachined structures in the bonded interface, the fracture mechanical properties of the interface as well as the loading situation.enMEMSsiliconwafer bonding531620conference paper