Thin chip foil packaging: An enabling technology for ultra-thin packages

Landesberger, C.C.LandesbergerPalavesam, N.N.PalavesamDrost, A.A.DrostHell, W.W.HellFaul, R.R.FaulKutter, C.C.Kutter2022-03-052022-03-052016https://publica.fraunhofer.de/handle/publica/248801en621Thin chip foil packaging: An enabling technology for ultra-thin packagesjournal article