Tekin, T.T.TekinZimmermann, L.L.ZimmermannSchröder, H.H.SchröderDumon, P.P.DumonBogaerts, W.W.BogaertsGalan, J.V.J.V.GalanSanchis, P.P.SanchisWhelan-Curtin, W.W.Whelan-CurtinBeggs, D.D.Beggs2022-03-112022-03-112010https://publica.fraunhofer.de/handle/publica/36916710.1117/12.8429992-s2.0-77951562963Generic packaging concepts for silicon photonics have been developed in the frame of EU-funded Network of Excellence ePIXnet (FP6). Three approaches for Silicon photonic packaging will be presented within this paper. Two concepts provide solutions for fiber array coupling to high-index contrast photonic wire waveguide gratings. Third concept is the integration of inverted taper-based fiber coupling structure with silicon etched V-grooves. Using standardized SOI chip designs and commercial available assembly parts, the packaging concepts allow for small footprint or flexible use in an R&D environment. The work presented here has resulted from cooperation within the European Network of Excellence ePIXnet.en621conference paper