März, M.M.März2022-03-032022-03-032006https://publica.fraunhofer.de/handle/publica/211826Performing electronic components for hybrid vehicles are subject to extreme demands relating to available space, usage temperature, reliability, and costs. System integration requires new paths in the direction of a three dimensional integration with mechatronic solution approaches, and new materials, and fabrication technologies. The Frauinhofer Institute for Integrated Systems and Construction Elements Technology (IISB) in Erlangen and Nuremberg, a leading research arm in this field, already works on the third generation of highly integrated drive units for hybrids.deKFZ-LeistungselektronikHybridantriebSystemintegrationHochtemperaturelektronikDC/DC-WandlerMechatronik670620530621journal article