Ramm, PeterPeterRammKlumpp, ArminArminKlumppLandesberger, ChristofChristofLandesbergerWeber, JosefJosefWeberBraun, TanjaTanjaBraunVivet, PascalPascalVivetEngelhard, ManfredManfredEngelhard2022-03-142022-03-142020https://publica.fraunhofer.de/handle/publica/409617en3D integration3DIC3D stackingheterogeneous integrationsensor integration6213DIC: Past, Present and Future - a European Perspectivepresentation