Gojdka, BjörnBjörnGojdkaCichon, DanielDanielCichonStahl-Offergeld, MarkusMarkusStahl-OffergeldSchröder, DominikDominikSchröderClausen, NielsNielsClausenHedayat, ChristianChristianHedayatHohe, Hans-PeterHans-PeterHoheLisec, ThomasThomasLisec2023-08-232023-08-232023https://publica.fraunhofer.de/handle/publica/44859610.1109/MEMS49605.2023.100521842-s2.0-85149880367This paper reports on a 3D Hall sensor back-biased by rare-earth micromagnets which are integrated directly into the silicon substrate using a wafer-level fabrication process, called PowderMEMS. For the first time, the technique is used to realize a fully integrated back-biased magnetic field sensor. The feasibility of the approach is proven by measurements of the motion of a rotating gear wheel which represents a typical back bias application. Additionally, the ability of the approach to create optimal magnetic field geometries for magnetically biased sensors is demonstrated.enback biasHall sensorIntegrated micromagnetsmagnetic biasmagnetic field shapingwafer-level integrationconference paper