Andersson, T.T.AnderssonNowak, D.D.NowakJohnson, T.T.JohnsonMark, A.A.MarkEdelvik, F.F.EdelvikKüfer, K.-H.K.-H.Küfer2022-03-052022-03-052018https://publica.fraunhofer.de/handle/publica/25673110.1115/1.4040086The thermal management is an ever increasing challenge in advanced electronic devices. In this paper, simulation-based optimization is applied to improve the design of a plate-fin heat-sink in terms of operational cost and thermal performance. The proposed framework combines a conjugate heat transfer solver, a CAD engine and an adapted Sandwiching algorithm. A key feature is the use of novel immersed boundary (IB) techniques that allows for automated meshing which is perfectly suited for parametric design optimization.en003536006519journal article