Altmann, F.F.AltmannPetzold, M.M.Petzold2022-03-052022-03-052016https://publica.fraunhofer.de/handle/publica/24449210.1109/MDAT.2016.2521828Physical failure analysis (PFA) gives unparalleled insight into the nature of microelectronic structures and their defects. Developments in 3-D integration and packaging techniques challenge the conventional PFA techniques and require new approaches. This article provides an overview of recent results in this domain achieved at Fraunhofer IWM.enjournal article