3D integration technologies for MEMS based on copper TSVs and copper-to-copper metal thermo compression bonding

Hofmann, LutzLutzHofmannBaum, MarioMarioBaumSchulz, Stefan E.Stefan E.SchulzWiemer, MaikMaikWiemerGeßner, ThomasThomasGeßner2022-03-122022-03-122013https://publica.fraunhofer.de/handle/publica/383062en3D integration technologies for MEMS based on copper TSVs and copper-to-copper metal thermo compression bondingconference paper