Thermo-mechanical properties and creep deformation of lead-containing and lead-free solders

Schubert, A.A.SchubertWalter, H.H.WalterDudek, R.R.DudekMichel, B.B.MichelLefranc, G.G.LefrancOtto, J.J.OttoMitic, G.G.Mitic2022-03-092022-03-092001https://publica.fraunhofer.de/handle/publica/33727010.1109/ISAOM.2001.916562en621Thermo-mechanical properties and creep deformation of lead-containing and lead-free soldersconference paper