Rudolph, CatharinaCatharinaRudolphWachsmuth, HolgerHolgerWachsmuthBoettcher, MathiasMathiasBoettcherSteller, WolframWolframStellerWolf, M. JürgenM. JürgenWolf2022-03-132022-03-132015https://publica.fraunhofer.de/handle/publica/395628New challenges have to be mastered with the introduction of Through Silicon Vias (TSVs) as a key element in 3D integration. This includes also the development and validation of various types of assembly and packaging concepts and methods. The investigations discussed here have been conducted on an interposer for sensor and CMOS devices.en621conference paper