Poppe, AndrĂ¡s2024-05-022024-05-022023979-8-3503-1863-0979-8-3503-1862-3https://publica.fraunhofer.de/handle/publica/46709910.1109/THERMINIC60375.2023en29th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2023