Mixed mode interfacial fracture toughness evaluation for flip chip assemblies and CSP based on fracture mechanics approaches

Auersperg, J.J.AuerspergKieselstein, E.E.KieselsteinSchubert, A.A.SchubertMichel, B.B.Michel2022-03-092022-03-092001https://publica.fraunhofer.de/handle/publica/337332en621Mixed mode interfacial fracture toughness evaluation for flip chip assemblies and CSP based on fracture mechanics approachesconference paper