Münchenberger, Finja M.Finja M.MünchenbergerDreiner, StefanStefanDreinerKappert, HolgerHolgerKappertNeubieser, Rahel-ManuelaRahel-ManuelaNeubieserVogt, HolgerHolgerVogt2022-03-142022-03-142020https://publica.fraunhofer.de/handle/publica/40841610.5162/SMSI2020/A5.1A process to integrate a thermocatalytic sensor on top of a CMOS circuitry is presented. Therefore, COMSOL Multiphysics® simulations are performed to evaluate a heater with an optimized temperature uniformity and a suspended design of the sensor element to achieve thermal decoupling from the substrate. The steps for fabrication are shortly described using ALD materials and a sacrificial layer. An example for a released heater structure is shown.enthermocatalytic sensor3D-Integrationatomic layer deposition (ALD)post-CMOSPellistors621conference paper