Pfitzner, L.L.PfitznerRyssel, H.H.RysselTemmel, G.G.TemmelZielonka, G.G.Zielonka2022-03-082022-03-081990https://publica.fraunhofer.de/handle/publica/317983Lithography clusters with on-line processing will be used for critical exposure steps. Spin coating optimization for ultraplanarized single/multi -layer resists are, therefore, a prerequisit for process reliability. Therefore, we compare in situ measured resist thickness during spin coating and baking with a mathematical modell in order to investigate parameters for fast closed loop cluster control. Results are used to discuss further automation concepts of on-line and in situ processing in lithography clusters.encontrol loopcontrol parameterendpoint detectionEndpunktdetektionFertigungHalbleiterin situLithographielithography clustermanufacturingon-lineprocess automationProzeßautomatisierungRegelkreisRegelparametersemiconductorZelle670620530conference paper