Kasulke, P.P.KasulkeAzdasht, G.G.AzdashtZakel, E.E.ZakelReichl, H.H.Reichl2022-03-092022-03-091997https://publica.fraunhofer.de/handle/publica/329069en621Solder ball bumping (SBB). A flexible equipment for FC, CSP, BGA and printed circuit boardsconference paper