Reducing On-Resistance for SiC Diodes by Thin Wafer and Laser Anneal Technology

Under CopyrightRusch, O.O.RuschHellinger, C.C.HellingerMoult, J.J.MoultCorcoran, Y.Y.CorcoranErlbacher, T.T.Erlbacher2022-03-1421.11.20192019https://publica.fraunhofer.de/handle/publica/40565210.24406/publica-fhg-405652en670620530Reducing On-Resistance for SiC Diodes by Thin Wafer and Laser Anneal Technologyposter