Klein, K.K.KleinRämer, O.O.RämerHoene, E.E.HoeneYasuda, Y.Y.YasudaIto, H.H.ItoKurita, F.F.KuritaEnoki, M.M.EnokiNakamura, H.H.NakamuraOkishiro, K.K.Okishiro2022-03-142022-03-142020https://publica.fraunhofer.de/handle/publica/409358This paper presents a new power module technology suitable for automotive high power and high-temperature applications. SiC MOSFETs are sintered into to the LTCC substrate cavity using silver sintering. The LTCC substrate with semiconductors inside is soldered to Si3N4-AMB. The primary DC link RC-snubber, driver booster, and high current contacts are soldered on the ceramic stack, building an electrical interface to the system PCB. Subsequently, the ceramic stack is covered by a plastic frame, encapsulated with silicone and pressed between the heatsink and the system PCB. The paper shows a base plate free water-cooling concept using a 3D printed aluminum heat sink with an ultra-short thermal path to coolant. The comprehensively designed 3D layout of power and control loops results in oscillation free switching of 160A at 750V DC link voltage with rise-times below 15ns.en621conference paper