DTIP of MEMS & MOEMS: Design, test, integration and packaging of MEMS/MOEMS 2003

Bergman, K.2022-03-022022-03-0220030-7803-7066-Xhttps://publica.fraunhofer.de/handle/publica/139541DTIP of MEMS & MOEMS: Design, test, integration and packaging of MEMS/MOEMS 2003