2022-03-082022-03-082002https://publica.fraunhofer.de/handle/publica/305491DE 20202374 U UPAB: 20020903 NOVELTY - A device for dividing wafers from semiconducting single crystal blocks comprises a separating unit (1) and an etching agent feed unit. Separating gaps (9) are created in separating tools (3) between separating foils (12) used to separate each wafer. DETAILED DESCRIPTION - Preferred Features: The device further comprises a foil holder for each separator foil. The foils are made from a material that is resistant to the etching agent used and electrical potentials applied. The separating tool is formed as a wire. USE - Used in the semiconductor chip industry. ADVANTAGE - Very thin wafers can be produced.de608621697Vorrichtung zum Zerteilen von KoerpernDevice for dividing wafers from semiconducting single crystal blocks comprises separating unit and etching agent feed unit with separating gaps created separating tools between separating foils used to separate each wafer.utility model2002-20202374