Azizi, MaralMaralAziziReimann, ChristianChristianReimannFriedrich, JochenJochenFriedrichBlankenburg, Hans-JoachimHans-JoachimBlankenburgColditz, RainerRainerColditz2022-03-082022-03-082014https://publica.fraunhofer.de/handle/publica/310141The present invention relates to a method for the treatment and/or recycling of sawing slurries, particularly of semiconductor materials, arising in mechanical cutting methods. The sawing slurries contain particles of semiconductor materials and silicon carbide and/or diamond particles. The method according to the invention specifies a two-stage treatment and/or recycling process in which, in a first stage, the slurries are treated at temperatures below the melting point of the semiconductor material and, in a second stage, the product obtained from the first stage is treated above the melting point of the semiconductor material. At least during the first stage and/or during the second stage, the slurry is introduced into a gas flow and/or a gas flows through and/or washes around it.de670patent102012017183