Wiedemann, G.G.WiedemannPanzner, M.M.PanznerHauptmann, J.J.Hauptmann2022-03-082022-03-081998https://publica.fraunhofer.de/handle/publica/304036The method concerns selective removal of one or several layers (3) from a substrate (1) or a layer which is to be left intact, using a laser (5), with self-regulating process limitation. Removal takes place during short interaction periods by means of a laser light with a wavelength such that its radiation is absorbed, by a layer (or layers) to be removed or to be preserved, to such an extent that its remaining energy no longer exceeds a threshold above which further material removal is possible. ADVANTAGE - Removal of layers without damaging the underlying surface is possible. Removal rates are increased, with improved removal selectivity.de608667621671patent1997-19715702