Under CopyrightHeitmann, UlrikeUlrikeHeitmannBartsch, JonasJonasBartschKluska, SvenSvenKluskaHuschmand Nia, NimaNimaHuschmand NiaWulf, JanaJanaWulfLackner, DavidDavidLacknerDimroth, FrankFrankDimrothJanz, StefanStefanJanz2022-03-152022-03-152021Note-ID: 00006142Note-ID: 0000678Ehttps://publica.fraunhofer.de/handle/publica/412863https://doi.org/10.24406/h-41286310.1109/PVSC43889.2021.951873810.24406/h-412863On the route to a high efficiency glued tandem solar cell fabricated using a ZnO-based transparent conductive adhesive, several challenges were encountered. By lowering the pressure during the annealing of the adhesive to 0.3 or 1 kg/cm2, the III-V surface did not crack and only minor delamination along the samples edge was observed. A fabricated tandem solar cell showed limitations due to voids within the bond (low fill factor) and a low current density due to a missing anti-reflective coating and reflectance at the bond layer. A sputtered TiO2:Nb contact layer showed a low ohmic contact on p-GaAs and thereby is suitable for implementation at the bond/III-V interface, which would significantly lower the reflectance at the bond.enreflectivityfabricationfill factor (solar cell)Photovoltaic cellssiliconohmic contactssurface crackstandem solar cellIII-V on SiTCA621697Challenges in the Fabrication of a Glued III-V on Si Tandem Solar Cell Using a ZnO-Based TCAconference paper