Dudek, R.R.DudekMichel, B.B.Michel2022-03-092022-03-091994https://publica.fraunhofer.de/handle/publica/323212The authors address the issue of thermo-mechanically stressed microelectronic assemblies. An approach combining finite element simulation and advanced in-situ measuring techniques is presented. Examples deal with the application of experimental methods such as micro moiré technique, speckle pattern photography and x-ray stress analysis in connection with numerical simulations. Problems of solder joint reliability are dealt with.enCOB-technologyelectronic packagingFEMfinite element analysislaser measuring technologymechanical reliabilitymicrosystemsSMTstress analysis621conference paper