Risse, StefanStefanRisseDamm, ChristophChristophDammHornaff, MarcelMarcelHornaffKamm, AndreasAndreasKammMohaupt, MatthiasMatthiasMohauptEberhardt, RamonaRamonaEberhardtSchmidt, IngoIngoSchmidtRamm, RolandRolandRammKühmstedt, PeterPeterKühmstedtNotni, GuntherGuntherNotniDöring, Hans-JoachimHans-JoachimDöringElster, ThomasThomasElsterKirschstein, Ulf CarstenUlf CarstenKirschsteinSchenk, ChristophChristophSchenk2022-03-042022-03-042012https://publica.fraunhofer.de/handle/publica/22905610.1016/j.mee.2012.04.014The fast and precise deflection of electron-beams is mandatory for common electron beam tools and next generation multi-beam lithography systems. Electrostatic fields generated by an arrangement of electrodes with several electric potentials are used to control the electron beam. The miniaturization of such a beam-deflection system facilitates its integration at a favorable place within the electron-optical column. An efficient and accurate beam deflection with high sensitivity and low aberrations is consequently possible. The novel wire-based electrostatic deflector for electron-beam Lithography Tools presented in this paper strictly pursues this approach. Design investigations as well as manufacturing and alignment procedures are reported. 24 wire electrodes are arranged in a circular FEA-optimized pattern and kinematically well-defined mounted to a supporting structure using the Solderjet Bumping technique . This flux free solder technique ensures vacuum compatible j oints free of hydrocarbons and with an excellent long-term stability. A prototype of the wire deflector is measured by means of a high resolution X-ray computer tomography scanner (CT) . The single wire elements of the wire deflector are symmetrically arranged to each other within an accuracy of a few microns.enelectron beam lithographywire deflectorelectron-optical columnprecision assemblysolderjet bumping multi shaped beamcomputed tomography measurement620621journal article