Michel, B.B.MichelGroßer, V.V.Großer2022-03-032022-03-031994https://publica.fraunhofer.de/handle/publica/184918The reliability of mirco-electronical and micro-mechanical components and assembly groups is considered. The deformation analysis by means of laser methods is determined. Examples are given e.g. the glob top problem (thermal behaviour of electronic encapsulation). Vibration analysis of PCB is presented also using laser metrology. Thermo-mechanical analysis of micro-components is carried out.deglob toplaser metrologyLasermeßtechnikmicromechanicsmicrosystem technologyMikromechanikMikrosystemtechnikSMTtesting621journal article