Under CopyrightSchletz, AndreasAndreasSchletzEndruschat, AchimAchimEndruschatHeckel, ThomasThomasHeckel2022-03-1427.5.20212021https://publica.fraunhofer.de/handle/publica/41124110.24406/publica-fhg-411241enSiC power modulesGaNpower electronics packaging670620530State of the Art Packagingpresentation