Hoose, T.T.HooseBillah, M.M.BillahBlaicher, M.M.BlaicherMarin, P.P.MarinDietrich, P.-I.P.-I.DietrichHofmann, A.A.HofmannTroppenz, U.U.TroppenzMöhrle, M.M.MöhrleLindenmann, N.N.LindenmannThiel, M.M.ThielSimon, P.P.SimonHoffmann, J.J.HoffmannGoedecke, M.L.M.L.GoedeckeFreude, W.W.FreudeKoos, C.C.Koos2022-03-132022-03-132016https://publica.fraunhofer.de/handle/publica/39392710.1364/OFC.2016.M2I.7We demonstrate coupling of surface and edge emitting InP lasers to silicon photonic chips using photonic wire bonding. We confirm that back-reflections from the silicon chip do not deteriorate the linewidth of the lasers.en621conference paper