Ribes, P.P.RibesKoechlin, C.C.KoechlinBurkhardt, T.T.BurkhardtHornaff, M.M.HornaffBurkhardt, D.D.BurkhardtKamm, A.A.KammGramens, S.S.GramensBeckert, E.E.BeckertFiault, G.G.FiaultEberhardt, R.R.EberhardtTünnermann, A.A.Tünnermann2022-03-132022-03-132016https://publica.fraunhofer.de/handle/publica/39412510.1117/12.22081232-s2.0-84981328185Solder joining using metallic solder alloys is an alternative to adhesive bonding. Laser-based soldering processes are especially well suited for the joining of optical components made of fragile and brittle materials such as glasses, ceramics and optical crystals. This is due to a localized and minimized input of thermal energy. Solderjet bumping technology has been used to assemble a lens mount breadboard taking as input specifications the requirements found for the optical beam expander for the European Space Agency (ESA) EarthCare Mission. The silica lens and a titanium barrel have been designed and assembled with this technology in order to withstand the stringent mission demands; handling high mechanical and thermal loads without losing its optical performances. Finally a high-precision opto-mechanical lens mount has been assembled with a minimal localized stress (<1 MPa) showing outstanding performances in terms of wave-front error measurements and beam depolarization ratio before and after environmental tests.en620conference paper