Chernobryvko, MykolaMykolaChernobryvkoKanitkar, Abhijeet MohanAbhijeet MohanKanitkarMüller, FriedrichFriedrichMüllerSchwanitz, OliverOliverSchwanitzNdip, IvanIvanNdipSchneider-Ramelow, MartinMartinSchneider-RamelowMurugesan, Kavin SenthilKavin SenthilMurugesanBraun, TanjaTanjaBraun2023-07-272023-07-272022https://publica.fraunhofer.de/handle/publica/44615310.1109/ESTC55720.2022.99395072-s2.0-85143131839D-band substrate integrated waveguide (SIW) bandpass filter with slots based on mold compound was manufactured and measured. The investigation shows the high potential of SIW filters to be integrated in packages using fan-out wafer level packaging (FOWLP). The manufactured sample was inspected using microscope to validate the measurements. The second order filter configuration demonstrates good selectivity properties. The measurements and full-wave modelling demonstrate a very good correlation in terms of magnitude and phase of return and insertion losses.en6GbandpassD-bandfan-out wafer level packagingfiltermoldSubstrate integrated waveguideconference paper