Rincon-Ruiz, CarlosCarlosRincon-RuizZschenderlein, UweUweZschenderleinKühn, MartinMartinKühnSelbmann, FranzFranzSelbmannWunderle, BernhardBernhardWunderle2026-03-242026-03-2420259798350393002https://publica.fraunhofer.de/handle/publica/51267110.1109/EuroSimE65125.2025.110065522-s2.0-105007413237Parylene has emerged as a promising substrate material in the development of electronic packaging due to its important dielectric properties, optical transparency, bio-compatibility, and mechanical flexibility. However, limited information exists regarding its performance and properties bonded to other packaging materials under cyclic loading, which is critical for long-term reliability. This study presents the development of a numerical-experimental method for characterizing the delamination behavior of parylene under fatigue conditions, essential for the design and simulation of electronic packaging. A fatigue cohesive zone model (FCZM) was formulated to describe the strength degradation of a Si-Parylene C interface and integrated to a finite element model of the sample structure. The parameters of the FCZM were calculated trough its fitting to experimental data from a custom setup.enfalsedelaminationfatigueparyleneconference paper