Zimmer, O.O.ZimmerSchwach, M.M.Schwach2022-03-082022-03-082010https://publica.fraunhofer.de/handle/publica/309471Die Erfindung betrifft ein Verfahren zum Aufbringen einer elektrisch leitfaehigen und optisch transparenten Metallschicht, ein Substrat mit dieser Metallschicht sowie dessen Verwendung. Die mit dem Verfahren ausgebildete Metallschicht soll eine Schichtdicke von weniger als 20 nm auf dem Substrat aufweisen. Die Abscheidung der Metallschicht auf der Oberflaeche des Substrats erfolgt unter Vakuum und mit einer elektrischen Lichtbogenentladung, die zwischen einem als Kathode geschalteten Target, das aus dem Metall der auszubildenden Metallschicht gebildet ist, und einer Anode ausgebildet wird. Die Lichtbogenentladung wird mit einem elektrischen Strom von mindestens 1,5 kA betrieben. Die in der Lichtbogenentladung gebildeten, zur Abscheidung der Metallschicht dienenden Ionen werden mit einem Filter gefiltert, in dem groessere Partikel separiert werden. Die Diffusion der Ionen auf der Substratoberflaeche soll durch Subplantation der Ionen im Substrat reduziert werden.The method comprises depositing a metal layer on the surface of the substrate under vacuum with an electric arc discharge that connects between targets as a cathode, where the metal layer is formed from the metal. An anode is formed, and an electric current is operated by 1.5 KA. The ions serving in the arc discharge formed for the deposition of metal layer are filtered through a filter in which larger particles are separated. The diffusion of the ions on the substrate surface is reduced by subplantation of the ions in the substrate. The method comprises depositing a metal layer on the surface of the substrate under vacuum with an electric arc discharge that connects between targets as a cathode. An anode is formed, and an electric current is operated by 1.5 KA. The ions serving in the arc discharge formed for the deposition of metal layer are filtered by a filter in which larger particles are separated. The diffusion of the ions on the substrate surface is reduced by subplantation of the ions in the substrate. The electrically conductive and optically transparent metal layer has a layer thickness of less than 20 nm on a substrate. The ions with kinetic ion energies are directed by 25 eV on the surface to be coated. The ions generated in the arc discharge are filtered by a change of its movement vector within a magnetic field and separated by the larger particles. The ions are produced with a pulsed operated electric arc. The method is repeated for a pulse length of the pulsed electric arc of less than 10-100 ms and the pulsed electric arc having a frequency of 0.1-1000 Hz. An additional optically transparent dielectric layer is deposited on the metal layer. A sequence of additional optically transparent dielectric layers and optically transparent metal layers is deposited by the layer thicknesses formed as an interference layer system on the substrate surface. The layers in a layer plane structure is/are separated. An independent claim is included for a substrate with an optically transparent and electrically conductive metal layer.de621patent102010051259