Oppermann, H.H.OppermannHutter, M.M.HutterEngelmann, G.G.EngelmannReichl, H.H.Reichl2022-03-102022-03-102005https://publica.fraunhofer.de/handle/publica/349242en621Passive alignment flip chip assembly using surface tension of liquid solder and micromechanical stopsconference paper